Meet the Team

Navid Gougol

CEO & Founder

Navid Gougol is the original inventor of YektaSonics core technology at University of California, Berkeley. He is a former chip designer at Advanced Micro Devices (AMD) and Sun microsystems (now Oracle) worked on next generation computing chips, part of the High Speed IO and microprocessor design teams. Before his PhD studies at the University of California, he holds MS and BS in Electrical and Computer Engineering from University of Southern California and University of Tehran, respectively. He was with Stanford University while in industry.

Ali Niknejad

He is a full professor in the Electrical Engineering and Computer Sciences Department at the University of California in Berkeley. He is a serial entrepreneur with Radio Frequency (RF) companies like LifeSignals and RF Pixels. 

He consults YektaSonics on RF/mixed-signal R&D.

Ted Selker

He is a serial entrepreneur, and a former professor at MIT and Carnegie Mellon University. He was a IBM Research fellow.

He advises YektaSonics on business and technology growth.

Balaram Behera — Software Engineer

He is a graduating computer science/math major at the University of California starting his PhD in math at Yale. He leads our software technology by developing mathematical algorithm for our beam-former feedback control system. 

 

 

 

 

 

 

 

 

 

Richard Fan — Software Engineer

He is  currently at the University of California majoring in Computer Sciences. He is part of our package development. Priorly in summer 2018, he developed a user interface for us.

Ray Huang — Software Engineer

He is currently a computer science major at Georgia Tech. He was a National Taiwan University presidential award recipient, conducted research on molecular and cell biology big data at NTU. An intern at NASA/JPL. He has contributed to our beam-former embedded computing interface.

 

 

 

 

 

 

 

 

Ambrose Liu — Mechanical Engineer

He is at the University of California majoring in Mechanical Engineering. He has been developing our 3D enclosure box for our array. 

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